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Pcb
Flex-rigid board C Ver. Flexible Printed Circuit Flex-rigid board + HDI Special board
12-layer just-wound board
Number of layers: 10L (4R+10F+4R)
Plate thickness: 2.0 ± 0.2mm
Minimum line width: 0.2mm/0.2mm
Minimum via hole / PAD: 0.4mm / 1.0mm
Minimum distance from hole to line: 0.3mm
Surface treatment: nickel-plated gold
Application area: control board
  • 12-layer just-wound board
    Number of layers: 10L (4R+10F+4R)
    Plate thickness: 2.0 ± 0.2mm
    Minimum line width: 0.2mm/0.2mm
    Minimum via hole / PAD: 0.4mm / 1.0mm
    Minimum distance from hole to line: 0.3mm
    Surface treatment: nickel-plated gold
    Application area: control board
  • 3rd order HDI
    Number of floors: 18

    Plate thickness: 2.2±0.22mm

    Line width line spacing: 0.10/0.10mm

    Two resin plug holes: inner resin plug holes for buried holes,

                                         outer resin plug holes and laser holes

    Application area: Aerospace

  • Industrial Control FPC
    Number of layers: 4L (1R + 2F + 1R)

    Plate thickness: 1.0±0.1mm 

    Minimum line width / line spacing: 0.2mm / 0.14mm

    Surface treatment: nickel-plated gold

    Size: 57mm*18mm

    Application area: industrial control
  • 8 layers of just wrapped plates
    Number of layers: 8L (1R+2F+1R)
    Plate thickness: 1.2±0.1mm
    Minimum line width / line spacing: 0.2mm / 0.14mm
    Surface treatment: nickel-plated gold
    Size: 57mm*18mm
    Application area: industrial control
  • 6 layers of just wound plate
    Number of layers: 6L (2R + 2F + 2R)
    Plate thickness: 0.8±0.1mm
    Minimum line width / line spacing: 0.076mm / 0.1mm
    Surface treatment: nickel-plated gold
    Size: 118mm*45mm
    Application area: consumer electronics
2-layer FPC
Surface treatment: electroplated gold

Number of floors: 2

Finished plate thickness: 0.12±0.03mm

Minimum finished hole diameter: 0.15mm 

Minimum line width / line spacing: 0.05/0.05mm

Particularity: Impedance accuracy ±10% 

Application: Car display

  • 2-layer FPC
    Surface treatment: electroplated gold

    Number of floors: 2

    Finished plate thickness: 0.12±0.03mm

    Minimum finished hole diameter: 0.15mm 

    Minimum line width / line spacing: 0.05/0.05mm

    Particularity: Impedance accuracy ±10% 

    Application: Car display

  • 4-layer FPC
    Surface treatment: immersion gold
    Number of floors: 4
    Finished plate thickness: 0.4+/-0.05mm
    Minimum finished hole diameter: 0.15mm
    Minimum line width / line spacing: 0.07/0.06mm
    Particularity:
    Application: Industrial Robot
  • 2-layer FPC
    Ultrasound probe soft board

    Name: Ultrasound probe soft board 

    Number of layers: 2L

    Material: PI 

    Plate thickness: 0.09mm

    Copper thickness: 6um ± 1um 

    Minimum aperture: 50um

    Size: 84mm*168mm 

    Surface treatment: electroplated soft gold

    Application area: medical 

    Features: ultra-thin copper, micro-hole, appearance zero defect FPC

  • 4-layer FPC
    Surface treatment: immersion gold

    Number of floors: 4 

    Finished plate thickness: 0.22mm

    Minimum finished hole diameter: 0.2mm

    Minimum line width / line spacing: 0.055/0.057mm

    Particularity: Impedance accuracy: ±10% Ω 

    Application: Drone

4 layers of just wrapped plates
Number of layers: 4L (1R + 3F)

Plate thickness: 0.866 ± 0.1mm 

Size: 121mm*72mm

Minimum line width / spacing: 0.1mm / 0.1mm 

Surface treatment: nickel-plated gold

Application area: Communication electronics
  • 4 layers of just wrapped plates
    Number of layers: 4L (1R + 3F)

    Plate thickness: 0.866 ± 0.1mm 

    Size: 121mm*72mm

    Minimum line width / spacing: 0.1mm / 0.1mm 

    Surface treatment: nickel-plated gold

    Application area: Communication electronics
  • 10-layer 2nd order HDI

    Product Category: Blind buried plate

    Number of layers: 10 (1+1+6+1+1)

    Plate thickness: 1.0mm

    Size: 205.015*62.53mm

    Plate used: FR4

    Minimum aperture: 0.10mm

    Surface treatment: OSP

    Application area: consumer

    Features: Electroplating blind hole process
  • 10-layer 3rd order HDI

    Product Category: Communication blind buried plate

    Number of layers: 6 layers (1+4+1)

    Plate thickness: 1.6mm

    Size: 190mm*150mm

    Plate used: FR4

    Minimum aperture: 0.2mm

    Surface treatment: immersion gold

    Application area: Communication

    Features: blind buried hole stacking
  • 8-layer graphics card
    Product Category: Graphics Card PCB

    Number of floors: 12 layers

    Plate thickness: 1.6mm

    Size: 290mm*136mm 

    Plate used: FR4

    Minimum aperture: 0.25mm 

    Surface treatment: OSP+ gold plating

    Application area: computer graphics 

    Features: gold-plated fingers

  • 10-layer power board
    Product Category: Power Thick Copper PCB

    Number of floors: 10 layers

    Plate thickness: 2.6mm

    Size: 180mm*220.5mm 

    Plate used: FR4

    Minimum aperture: 0.35mm 

    Surface treatment: immersion gold

    Application area: power supply 

    Features: Copper thickness 4OZ

  • 4-layer 1st order HDI
    Product Category: Communication blind buried plate
    Number of floors: 4 layers
    Plate thickness: 1.0mm
    Size: 137.16mm*89.92mm
    Plate used: FR4
    Minimum aperture: 0.25mm
    Surface treatment: immersion gold
    Application area: Communication
    Features: blind buried hole design
  • 8-layer security board
    Product Category: Security PCB

    Number of floors: 8 layers 

    Plate thickness: 1 +/- 0.1mm

    Size: 248.02mm * 112mm

    Plate used: Taiwan Light (EM-825)

    Minimum aperture: 0.2mm 

    Surface treatment: immersion gold

    Minimum line width / distance: 0.104mm / 0.098mm 

    Terminal products: security IPC board

  • 32-layer communication board
    Product Category: Communication Backplane PCB

    Number of floors: 28 layers 

    Plate thickness: 5.46+/-0.533mm

    Size: 165.1mm*87.63mm

    Plate used: FR4

    Surface treatment: immersion gold 

    Application area: Communication

    Features: high multilayer backplane
  • Optical module PCB
    Model: M6W5421
    Number of floors: 6 layers
    Plate thickness: 1 +/- 0.1mm
    Size: 95.51mm*65.88mm
    Plate used: Lianmao (IT180)
    Sheet TG value: 170 degrees
    Minimum aperture: 0.25mm
    Surface treatment: hard gold plating
    Jin Hou:>20U"
    Minimum line width / distance: 0.14mm / 0.146mm
    Dimensional tolerance: 0.05mm (industry: 0.1mm)
    Terminal products: industrial optical communication module
    Gold finger to side tolerance: 0.05mm (industry: 0.1mm)
  • High load power PCB
    Number of floors: 32

    Plate thickness: 3.50±0.35mm 

    Size: 80mm*160mm

    Process: half hole processing technology 

    EMC EM-827

    Application area: Power Electronics
  • Back drill PCB
    Number of floors: 18

    Plate thickness: 5.4 ± 0.5mm

    Size: 200*442mm

    Minimum line width / spacing: 0.13/0.1mm

    Back drill L10-L18 Depth: 2.57±0.1mm/

    Back drill L8-L18 back drill: 3.05±0.1mm

    Surface treatment: nickel-gold, impedance control

  • High density LEDPCB
    Number of floors: 6

    Plate thickness: 2.0±0.15mm 

    PAD distance board edge: 0.1mm

    Dimensional tolerance requirements: ±0.05mm

    Plate bending control requirements: ≦ 0.5% 

    Resistance to soldering tolerance: ±0.05mm

    Application area: HD LED display
Multifunctional integrated copper plate
Number of floors: 12

Plate thickness:2.6mm

Copper thickness oz:1

Material:Rogers4350B+FR4

Type: metal base power amplifier board

Technical features: "Integrated design
Local mixed pressure
PCB buried I / U copper
Control deep power amplifier slot"
Uses: wireless communication base station
  • Multifunctional integrated copper plate
    Number of floors: 12

    Plate thickness:2.6mm

    Copper thickness oz:1

    Material:Rogers4350B+FR4

    Type: metal base power amplifier board

    Technical features: "Integrated design
    Local mixed pressure
    PCB buried I / U copper
    Control deep power amplifier slot"
    Uses: wireless communication base station
  • ODU RF board
    Number of layers: 10

    Plate thickness: 2.0mm 

    Copper thickness: 1OZ

    Material: RO4350+FR4 

    Uses: microwave

    Process point: step waveguide slot
  • Ceramic substrate
    Number of floors: 2
    Plate thickness: 0.5±0.05mm
    Size: 5mm*2mm
    Application area: industrial induction

  • Buried server PCB
    Buried server PCB
    Number of floors: 24
    Plate thickness: 2.1 ± 0.21mm
    Minimum aperture: 0.3mm
    Line width line spacing: 0.127mm / 0.127mm
    Surface treatment: nickel-plated gold
    Process: 24 layers buried, C-Ply and NELCO N4000-13EP mixed pressure three times
    Application area: server
  • Car radar PCB
    Number of floors: 6

    Plate thickness: 1.6mm ± 0.16

    Process: Rogers + FR-4 mixed pressure, mechanical blind hole + laser blind hole, 

    laser blind hole conformal mask flow, RF antenna line width control +/- 5um, 

    outer line step copper thickness (outer layer most area copper thickness ≥ 35um, 

    the RF antenna area is 13-23um thick.)

    Application area: automotive radar
  • Partially buried copper-based PCB
    Number of floors: 14

    Plate thickness: 1.6±0.16mm 

    Size: 150mm*160mm

    Minimum line width / spacing: 0.08/0.1mm

    Impedance control

    Application area: Communication