GalaxyPCB - Product

Pcb

Flex-rigid board C Ver. Flexible Printed Circuit Flex-rigid board + HDI Special board

12-layer just-wound board

Number of layers: 10L (4R+10F+4R)
Plate thickness: 2.0 ± 0.2mm
Minimum line width: 0.2mm/0.2mm
Minimum via hole / PAD: 0.4mm / 1.0mm
Minimum distance from hole to line: 0.3mm
Surface treatment: nickel-plated gold
Application area: control board

12-layer just-wound board

Number of layers: 10L (4R+10F+4R)
Plate thickness: 2.0 ± 0.2mm
Minimum line width: 0.2mm/0.2mm
Minimum via hole / PAD: 0.4mm / 1.0mm
Minimum distance from hole to line: 0.3mm
Surface treatment: nickel-plated gold
Application area: control board
3rd order HDI

Number of floors: 18

Plate thickness: 2.2±0.22mm

Line width line spacing: 0.10/0.10mm

Two resin plug holes: inner resin plug holes for buried holes,

outer resin plug holes and laser holes

Application area: Aerospace
Industrial Control FPC

Number of layers: 4L (1R + 2F + 1R)

Plate thickness: 1.0±0.1mm

Minimum line width / line spacing: 0.2mm / 0.14mm

Surface treatment: nickel-plated gold

Size: 57mm*18mm
Application area: industrial control
8 layers of just wrapped plates

Number of layers: 8L (1R+2F+1R)
Plate thickness: 1.2±0.1mm
Minimum line width / line spacing: 0.2mm / 0.14mm
Surface treatment: nickel-plated gold
Size: 57mm*18mm
Application area: industrial control
6 layers of just wound plate

Number of layers: 6L (2R + 2F + 2R)
Plate thickness: 0.8±0.1mm
Minimum line width / line spacing: 0.076mm / 0.1mm
Surface treatment: nickel-plated gold
Size: 118mm*45mm
Application area: consumer electronics

2-layer FPC

Surface treatment: electroplated gold

Number of floors: 2

Finished plate thickness: 0.12±0.03mm

Minimum finished hole diameter: 0.15mm

Minimum line width / line spacing: 0.05/0.05mm

Particularity: Impedance accuracy ±10%

Application: Car display

2-layer FPC

Surface treatment: electroplated gold

Number of floors: 2

Finished plate thickness: 0.12±0.03mm

Minimum finished hole diameter: 0.15mm

Minimum line width / line spacing: 0.05/0.05mm

Particularity: Impedance accuracy ±10%

Application: Car display
4-layer FPC

Surface treatment: immersion gold
Number of floors: 4
Finished plate thickness: 0.4+/-0.05mm
Minimum finished hole diameter: 0.15mm
Minimum line width / line spacing: 0.07/0.06mm
Particularity:
Application: Industrial Robot
2-layer FPC

Ultrasound probe soft board

Name: Ultrasound probe soft board

Number of layers: 2L

Material: PI

Plate thickness: 0.09mm

Copper thickness: 6um ± 1um

Minimum aperture: 50um

Size: 84mm*168mm

Surface treatment: electroplated soft gold

Application area: medical

Features: ultra-thin copper, micro-hole, appearance zero defect FPC
4-layer FPC

Surface treatment: immersion gold

Number of floors: 4

Finished plate thickness: 0.22mm

Minimum finished hole diameter: 0.2mm

Minimum line width / line spacing: 0.055/0.057mm

Particularity: Impedance accuracy: ±10% Ω

Application: Drone

4 layers of just wrapped plates

Number of layers: 4L (1R + 3F)

Plate thickness: 0.866 ± 0.1mm

Size: 121mm*72mm

Minimum line width / spacing: 0.1mm / 0.1mm

Surface treatment: nickel-plated gold

Application area: Communication electronics

4 layers of just wrapped plates

Number of layers: 4L (1R + 3F)

Plate thickness: 0.866 ± 0.1mm

Size: 121mm*72mm

Minimum line width / spacing: 0.1mm / 0.1mm

Surface treatment: nickel-plated gold
Application area: Communication electronics
10-layer 2nd order HDI

Product Category: Blind buried plate

Number of layers: 10 (1+1+6+1+1)

Plate thickness: 1.0mm

Size: 205.015*62.53mm

Plate used: FR4

Minimum aperture: 0.10mm

Surface treatment: OSP

Application area: consumer
Features: Electroplating blind hole process
10-layer 3rd order HDI

Product Category: Communication blind buried plate

Number of layers: 6 layers (1+4+1)

Plate thickness: 1.6mm

Size: 190mm*150mm

Plate used: FR4

Minimum aperture: 0.2mm

Surface treatment: immersion gold

Application area: Communication
Features: blind buried hole stacking
8-layer graphics card

Product Category: Graphics Card PCB

Number of floors: 12 layers

Plate thickness: 1.6mm

Size: 290mm*136mm

Plate used: FR4

Minimum aperture: 0.25mm

Surface treatment: OSP+ gold plating

Application area: computer graphics

Features: gold-plated fingers
10-layer power board

Product Category: Power Thick Copper PCB

Number of floors: 10 layers

Plate thickness: 2.6mm

Size: 180mm*220.5mm

Plate used: FR4

Minimum aperture: 0.35mm

Surface treatment: immersion gold

Application area: power supply

Features: Copper thickness 4OZ
4-layer 1st order HDI

Product Category: Communication blind buried plate
Number of floors: 4 layers
Plate thickness: 1.0mm
Size: 137.16mm*89.92mm
Plate used: FR4
Minimum aperture: 0.25mm
Surface treatment: immersion gold
Application area: Communication
Features: blind buried hole design
8-layer security board

Product Category: Security PCB

Number of floors: 8 layers

Plate thickness: 1 +/- 0.1mm

Size: 248.02mm * 112mm

Plate used: Taiwan Light (EM-825)

Minimum aperture: 0.2mm

Surface treatment: immersion gold

Minimum line width / distance: 0.104mm / 0.098mm

Terminal products: security IPC board
32-layer communication board

Product Category: Communication Backplane PCB

Number of floors: 28 layers

Plate thickness: 5.46+/-0.533mm

Size: 165.1mm*87.63mm

Plate used: FR4

Surface treatment: immersion gold

Application area: Communication
Features: high multilayer backplane
Optical module PCB

Model: M6W5421
Number of floors: 6 layers
Plate thickness: 1 +/- 0.1mm
Size: 95.51mm*65.88mm
Plate used: Lianmao (IT180)
Sheet TG value: 170 degrees
Minimum aperture: 0.25mm
Surface treatment: hard gold plating
Jin Hou:>20U"
Minimum line width / distance: 0.14mm / 0.146mm
Dimensional tolerance: 0.05mm (industry: 0.1mm)
Terminal products: industrial optical communication module
Gold finger to side tolerance: 0.05mm (industry: 0.1mm)
High load power PCB

Number of floors: 32

Plate thickness: 3.50±0.35mm

Size: 80mm*160mm

Process: half hole processing technology

EMC EM-827
Application area: Power Electronics
Back drill PCB

Number of floors: 18

Plate thickness: 5.4 ± 0.5mm

Size: 200*442mm

Minimum line width / spacing: 0.13/0.1mm

Back drill L10-L18 Depth: 2.57±0.1mm/

Back drill L8-L18 back drill: 3.05±0.1mm

Surface treatment: nickel-gold, impedance control
High density LEDPCB

Number of floors: 6

Plate thickness: 2.0±0.15mm

PAD distance board edge: 0.1mm
Dimensional tolerance requirements: ±0.05mm

Plate bending control requirements: ≦ 0.5%

Resistance to soldering tolerance: ±0.05mm
Application area: HD LED display

Multifunctional integrated copper plate

Number of floors: 12

Plate thickness:2.6mm

Copper thickness oz:1

Material:Rogers4350B+FR4

Type: metal base power amplifier board

Technical features: "Integrated design
Local mixed pressure
PCB buried I / U copper
Control deep power amplifier slot"
Uses: wireless communication base station

Multifunctional integrated copper plate

Number of floors: 12

Plate thickness:2.6mm

Copper thickness oz:1

Material:Rogers4350B+FR4

Type: metal base power amplifier board
Technical features: "Integrated design
Local mixed pressure
PCB buried I / U copper
Control deep power amplifier slot"
Uses: wireless communication base station
ODU RF board

Number of layers: 10

Plate thickness: 2.0mm

Copper thickness: 1OZ

Material: RO4350+FR4

Uses: microwave
Process point: step waveguide slot
Ceramic substrate

Number of floors: 2
Plate thickness: 0.5±0.05mm
Size: 5mm*2mm
Application area: industrial induction
Buried server PCB

Buried server PCB
Number of floors: 24
Plate thickness: 2.1 ± 0.21mm
Minimum aperture: 0.3mm
Line width line spacing: 0.127mm / 0.127mm
Surface treatment: nickel-plated gold
Process: 24 layers buried, C-Ply and NELCO N4000-13EP mixed pressure three times
Application area: server
Car radar PCB

Number of floors: 6

Plate thickness: 1.6mm ± 0.16

Process: Rogers + FR-4 mixed pressure, mechanical blind hole + laser blind hole,

laser blind hole conformal mask flow, RF antenna line width control +/- 5um,

outer line step copper thickness (outer layer most area copper thickness ≥ 35um,

the RF antenna area is 13-23um thick.)
Application area: automotive radar
Partially buried copper-based PCB

Number of floors: 14

Plate thickness: 1.6±0.16mm

Size: 150mm*160mm

Minimum line width / spacing: 0.08/0.1mm

Impedance control
Application area: Communication

Pcb

12-layer just-wound board

12-layer just-wound board

3rd order HDI

Industrial Control FPC

8 layers of just wrapped plates

6 layers of just wound plate

2-layer FPC

2-layer FPC

4-layer FPC

2-layer FPC

4-layer FPC

4 layers of just wrapped plates

4 layers of just wrapped plates

10-layer 2nd order HDI

10-layer 3rd order HDI

8-layer graphics card

10-layer power board

4-layer 1st order HDI

8-layer security board

32-layer communication board

Optical module PCB

High load power PCB

Back drill PCB

High density LEDPCB

Multifunctional integrated copper plate

Multifunctional integrated copper plate

ODU RF board

Ceramic substrate

Buried server PCB

Car radar PCB

Partially buried copper-based PCB